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TANAKA Develops 70 degrees C Low-temperature Sintering Technology using Silver Nano Ink and Full-surface Silver Metal Film Forming Technology using Etching Processes

  • Written by ACN Newswire

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Low-temperature sintered silver nano ink
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Full-surface silver metal film
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5 micrometers pattern by photolithography
New technologies expected to reduce thickness, increase flexibility, and enhance image quality for touch panels and organic electroluminescence displays

TOKYO, Sep 12, 2018 - (ACN Newswire) - TANAKA Holdings Co., Ltd. (Head office:...

Read more: TANAKA Develops 70 degrees C Low-temperature Sintering Technology using Silver Nano Ink and...